Description:
Saline Lectronics Inc., an ISO certified 9001:2000 organization, specializes in electronic manufacturing services concentrating on mid-volume, multi-layer, high-mix electronic printed circuit board assembly. We provide electronic contract manufacturing services ranging from electrical design engineering — including DFMA — to state-of-the-art manufacturing technologies, BGA repair, through hole assembly, PCB assembly, circuit board assembly testing and product assembly (box builds).

From management to our customer service and production teams, our goal is consistent: Deliver the highest quality circuit boards on time, on budget, with the best customer service possible. And to keep track of your project"s progress, a specially assigned Program Manager will keep you informed during every step of the production process.

We offer the latest in SMT, THT, BGA and Micro-BGA capability, in addition to mixed technology assembly. Keeping on the forefront of component requirements, we offer surface mount placement down to 12 mil pitch, with a component range of 0402 to 52 mm square QFPs and BGAs. To ensure the highest level of quality, we provide extensive BGA/Micros-BGA x-Ray, in-circuit, flying probe and functional testing.

Our facilities offer the latest technological capabilities to meet your most demanding project requirements.

-BGA, Micro-BGA, supported with X-Ray and Rework Stations
-Surface Mount and Through-Hole Technology
-Humidity-Protected Storage
-Multiple Continuous Flow Linked Production Lines
-Dedicated Aqueous and No-Clean Solder Chemistry
-Potting and Conformal Coating
-Final Product Assembly (Box Build)
-Fully Integrated MRP System
-Supplier Performance Management System
-Supply Chain Management
-Kanban System
-Consignment Programs for Customer-Finished Products
-Flying Probe
-In-Circuit Testing
-Functional Testing
-X-Ray Inspection

Saline Lectronics provides the latest in SMT, THT, BGA and Micro-BGA capability, in addition to mixed technology assemblies. We offer surface mount placement down to 12mil pitch, with a component range of 0402 to 52mm square QFPs and BGAs. And to ensure the highest level of quality, we provide extensive BGA/Micros-BGA X-Ray, In-Circuit, Flying Probe and Functional testing.

Keeping up with the latest technology is our Selective Soldering System. Patented features in our equipment give it the ability to solder pads as small as .010 inches resulting in a tool-less system for almost any soldering application. This equipment specializes in troublesome through-hole components in SMT assemblies from the underside (connectors, power supplies, coils, relays, batteries and odd-forms.) Ideal for accessing sites inside of assembly cases or sites shadowed by obstructions.

Located in Southeast Michigan, we are conveniently located minutes from Ann Arbor and less than an hour from Detroit. Experience the Saline Lectronics difference for yourself. Call 734-944-2120 today