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LSI Logic Offers Unprecedented System Integration Within Smallest Package Form Factor

Flexible Wafer-level Packaging Methodology Allows Same Silicon Design to Be
Offered in Wire-bond or Flip-chip Bump Interconnect Format

MILPITAS, Calif., May 19 /PRNewswire-FirstCall/ -- LSI Logic Corporation (NYSE: LSI) today announced the availability of its enhanced wafer-level packaging (WLP) technology for use in ASIC/SoC designs. Packages produced in this cost-effective, high-performance technology are completely manufactured and tested at the wafer level and then mounted directly onto printed circuit boards or on discrete package substrates. WLP offers the industry's lowest cost packaging solution in an ultra small form factor with improved electrical performance. System designers making use of WLP can conserve valuable board real estate while integrating additional features into portable applications such as cell phones, PDAs and other handheld consumer devices.

The flexible WLP design methodology offered by LSI Logic enables a single design to accommodate a variety of package technology formats. By only modifying the top metal layer, the chip design can be re-configured for flip-chip, wire-bond or direct chip attach interconnect solutions. With this approach, system designers gain considerable design flexibility and intellectual property (IP) re-use with minimal development effort, thereby drastically reducing non-recurring engineering (NRE) costs and speeding time-to-market.

"WLP technology broadens the LSI Logic packaging portfolio and enables more flexible system-level design solutions where a small form factor is required," said Stan Mihelcic, director of Packaging and I/O Marketing at LSI Logic. "Our unique methodology also provides our customers with the additional flexibility of accommodating either a wire-bond or flip-chip bump interconnect format. This is especially important for system designers who require variations of a standard chip design utilizing deep-submicron ASIC/SoC technology." The die in a WLP format can be connected directly to the host system board, eliminating traditional packaging parasitics. This electrical

performance enhancement enables more flexible system-level design solutions for high performance memory interfaces and serializer/deserializer (SerDes) technology where stringent system timing budgets continue to challenge system designers. By leveraging existing wafer processing techniques, engineers can co-design and develop an optimal bump layout to suit the particular application. A typical concern with die only packages has been the ability to provide a fully tested "Known Good Die" (KGD) product. However, with advanced wafer level test methodologies and wafer level reliability offered by LSI Logic, true KGD products are possible requiring no additional package level final test.

In addition to portable handheld consumer devices, WLP technology also enables new product growth in industrial, medical and military applications that require a small form factor. LSI Logic supplies ASIC/SoC solutions to these markets with domestic manufacturing capability. Customers adopting WLP can make use of standard surface mount assembly techniques without changing existing equipment and processes. WLP offered by LSI Logic is available in both eutectic and RoHS compliant lead-free solder terminations, eliminating the use of hazardous leaded solder material from the manufacturing process.

Availability
WLP solutions are available today in high volumes to LSI Logic customers.

About LSI Logic Corporation
LSI Logic Corporation focuses on the design and production of high-performance semiconductors for Consumer, Communications and Storage applications that access, interconnect and store data, voice and video. LSI Logic engineers incorporate reusable, industry-standard intellectual property building blocks that serve as the heart of leading-edge systems. LSI Logic serves its global OEM, channel and distribution customers with standard-cell ASICs, Platform ASICs and standard products, host bus adapters, RAID controllers and software. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. http://www.lsilogic.com .

Notes to Editor:
1. All LSI Logic news releases (financial, acquisitions, manufacturing, products, technology etc.) are issued exclusively by PR Newswire and are immediately thereafter posted on the company's external website, http://www.lsilogic.com .
2. LSI Logic, the LSI Logic logo are trademarks or registered trademarks of LSI Logic Corporation.
3. Please do not assign a Reader Service number to this release.

SOURCE LSI Logic Corporation
Web Site: http://www.lsilogic.com

The new ESPRIMO E PCs: modular and ergonomic with Green PC technology

Fujitsu Siemens Computers introduces the latest addition to its environmentally conscious, flexible and investment-friendly professional PCs

(I-Newswire) - Fujitsu Siemens Computers, the leading European IT manufacturer and a pioneer in environmentally conscious PC technology, today announced the availability of the latest addition to its range of professional PCs. The extremely silent ESPRIMO E, a Small Form Factor PC ( SFF ), comes with new manageability and flexibility features as well as Fujitsu Siemens Computers’ innovative Green PC technology. The ESPRIMO E5905 is based on the latest Intel® 945G Express Chipset, while the ESPRIMO E5901 is also equipped with Intel® Active Management Technology. ESPRIMO E Series models can now be obtained throughout the EMEA region ( Europe, Middle East and Africa ). Prices in Germany start at €849 ( incl. VAT ).

The Small Form factor PC ESPRIMO E was designed as standard desktop for demanding office applications in large networks. It is thus particularly well suited to organizations with 1,000-plus employees, where factors like trouble-free operation in open-plan offices and flexible expansion options are especially important when purchasing PCs. With this in mind, Fujitsu Siemens Computers equipped the ESPRIMO E Series with adaptable rear panels and flexible slots; either for four low-profile cards or two full-height PCI cards combined with one low-profile card. The enhanced cooling concept means the new models are the quietest in their class, and the switched monitor outlet system saves energy since the PC automatically controls the monitor’s power supply.

Technical highlights:
- Intel® Corporate Stable Platforms including new Intel® 945G Express Chipset and Intel® Pentium® 4 Processors with hyper-threading technology. ( Also available with the new Intel® Pentium® D 82x sequence dual core processors. )
- Optional with Intel® Active Management Technology
- Improved expandability, allowing the 3.5-inch drive to be used for:
-- a second hard disk;
-- an internal SmartCard reader;
-- a MultiCard reader;
-- a WLAN module.
- Adaptable rear panel:
-- version A with four low-profile cards.
-- version B with two full-height PCI cards and one low-profile PCI Express x16 card.
- Second serial port optional via cable.
- Standard front audio and front USB ( 2x ) connectors.
- Configurable security features ( SmartCard reader, intrusion switch, lock ).
- Enhanced cooling concept for extremely quiet operation ( 24dB with heavy system load ).

About the ESPRIMO product family

ESPRIMO professional PCs, manufactured in Augsburg, Germany, deliver the latest in cutting-edge technology in an environmentally conscious package. All three lines of the new ESPRIMO global brand, which was announced together with Fujitsu Ltd. in April, have a modular design for easy upgrading. The ESPRIMO P5905 Microtower has been available since May as part of the Intel® Stable Image Platform Program. The space-conscious Ultra-Small Form Factor ESPRIMO C Series, meanwhile, will hit the market in July.

Modular system
Fujitsu Siemens Computers has been building upon the proven strengths of its desktop PCs to offer a flexible configuration system. Depending on their requirements, customers can choose between standard PCs, special features such as enhanced security and performance, and long term available configurations. In any case, every system can flexibly be upgraded, and that means additional investment protection.

Ergonomics and the environment
All professional PCs from Fujitsu Siemens Computers will comply with RoHS six months before the stringent new set of EU guidelines restricting the use of hazardous substances goes into effect in mid-2006. Lead content in the mainboards has already been reduced from around 12 grams to only one gram, and the printed circuit board, power supply and riser card are all halogen-free. As mentioned, ergonomics has also been enhanced. The advanced cooling concept used in all ESPRIMO PCs makes them even quieter for a better ( and more productive ) work environment.

Lifecycle management and serviceability
The improved cabinet design of the ESPRIMO Professional PCs increases the possibilities when it comes to servicing and upgrades, while the ManageIT and SecureIT software suites ensure secure and trouble-free operation. What’s more, lifecycles of up to 18 months are made possible by the stable configurations and components as well as the Intel® Stable Image Platform Program.

Photos of the new ESPRIMO E Series are available at the Fujitsu Siemens Computers Photoserver.

– end –

About Fujitsu Siemens Computers:
Fujitsu Siemens Computers is the leading European IT provider with a responsible strategic focus on next-generation Mobility and Business Critical Computing products, services and solutions. With a portfolio of exceptional depth, our offering extends from handhelds through desktops to enterprise-class IT infrastructure solutions. Fujitsu Siemens Computers has a strong presence in all key markets across Europe, the Middle East and Africa. Leveraging the strengths, innovation and global reach of our joint shareholders, Fujitsu Limited and Siemens AG, we make sure we meet the needs of customers: large corporations, small and medium enterprises and private users.

For further information about Fujitsu Siemens Computers, please visit: www.fujitsu-siemens.com

PR Contacts:
Amy M.K. Flécher
Senior Director Communications
Tel.: + 49 ( 0 ) 89 3222 4460
Mobile: + 49 ( 0 ) 171 86 50 101
Fax: + 49 ( 0 ) 89 3222 4466
amy.flecher@fujitsu-siemens.com

Sabine Twest
Senior PR Manager
Tel.: + 49 ( 0 ) 89 3222 4457
Mobile: + 49 ( 0 ) 175 18 62 082
Fax: + 49 ( 0 ) 89 3222 4466
sabine.twest@fujitsu-siemens.com

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