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Analog Devices Packs Improved OP07 Performance Into Tiny Package, Reducing Board Space By 75%

ADI’s new iPolar™ trench isolation manufacturing process yields amplifiers that save board space and improve layout flexibility in industrial measurement and control systems.

i-Newswire, 2005-05-16 - Analog Devices, Inc. ( NYSE: ADI ), a global leader in high-performance semiconductors for signal-processing applications, today introduced an operational amplifier ( op amp ) that is one-quarter the size of competitive offerings while providing improved accuracy compared to high-performance, ultra-low-offset-voltage op amps like ADI’s industry-standard OP07. Addressing the needs of applications such as industrial PLCs ( programmable logic controllers ), ATE ( automated test equipment ) platforms, and machine monitoring systems, the AD8677 is manufactured on ADI’s new iPolar™ trench isolation process technology to reduce power consumption by 40 percent while maintaining a 75 microvolts ( maximum ) voltage offset and 1.3 microvolts/degrees C ( maximum ) drift.

This outstanding level of performance is packed into a tiny 3 mm x 3 mm TSOT-23 ( thin small outline transistor ) package. The increased accuracy, small package size and lower power consumption make the AD8677 ideal for precision thermal and current sensing and precision filtering applications that require the high performance of an op amp like the OP07, but also need a reduction in system size.

“Analog Devices set the standard for ultra-low-offset voltage amplifiers with the OP07. Now, with the introduction of the AD8677—made possible by ADI’s new iPolar trench isolation process—we are able to improve OP07 performance in one-quarter the footprint,” said Steve Sockolov, product line director, Precision Amplifier Group, at Analog Devices. “This new amp answers the call from designers of instrumentation and test and measurement equipment, who have been demanding low-noise components with greater precision that don’t eat up valuable board space.”

About the AD8677—Improving OP07 Performance
In addition to the smaller die size enabled by ADI’s new iPolar process, the AD8677 provides greater accuracy than the OP07. Performance enhancements include higher CMRR ( common-mode rejection ratio ) of 130 dB, an enhanced PSRR ( power supply rejection ratio ) of 110 dB and a wider output swing of ±14 V. The higher CMRR and PSRR improve system performance by increasing immunity to power supply fluctuations and other environmental signal interference.

The 1.2-mA power consumption of the AD8677 lowers thermal output relative to competing devices and reduces the need for additional cooling with heat sinks or fans. The new amp’s low input bias current of ±2 nA and high open-loop gain further reduce system errors. High open loop gain insures linearity and gain accuracy over the wide input signal range of ±13V, even at high closed loop gains. With very high 80 degree phase margin, AD8677 is extremely tolerant of both parasitic capacitance caused by PCB layout and external load and filtering capacitances, making it supremely easy to use.

Pricing and Availability
The AD8677 is sampling now and will be available in production quantities in September of 2005. Fully specified to operate over an extended industrial temperature range of –40 degrees C to + 125 degrees C, the device is available in a 5-lead TSOT-23, as well as 8-lead narrow SOIC ( small outline integrated circuit ) package.

About Analog Devices’ iPolar High-Voltage Trench Isolation Process Technology
The ±18-V iPolar process from ADI improves upon the best characteristics of precision bipolar and JFET processes by using a lateral dielectric isolation technique and completely redesigned transistors that are optimized for speed, noise, matching, linearity and stability. The industry’s most significant re-engineering of 36-V bipolar technology in nearly 20 years, iPolar is a stable, high-voltage manufacturing methodology that replaces the bulky diffusion layers of traditional bipolar processes with a deep trench technique than dramatically increases transistor density per die.

Analog Devices in Industrial
Analog Devices has a 40-year heritage of working in concert with its customers in the industrial manufacturing industry to define, develop and deploy complete signal chain solutions that are optimized for their applications. ADI’s legacy of supporting the industrial sector’s long product lifecycles with multi-year manufacturing commitments is augmented by the company’s educated sales force, knowledgeable field applications engineers and advanced design support tools that include evaluation boards and SPICE models.

About Analog Devices
Innovation, performance, and excellence are the cultural pillars on which Analog Devices has built one of the longest standing, highest growth companies within the technology sector. Acknowledged industry-wide as the world leader in data conversion and signal conditioning technology, Analog Devices serves over 60,000 customers, representing virtually all types of electronic equipment. Celebrating 40 years as a leading global manufacturer of high-performance integrated circuits used in analog and digital signal processing applications, Analog Devices is headquartered in Norwood, Massachusetts, with design and manufacturing facilities throughout the world. Analog Devices' common stock is listed on the New York Stock Exchange under the ticker “ADI” and is included in the S&P 500 Index.

1 iPolar and iCMOS are registered trademarks of Analog Devices, Inc.

Editor's Contact Information:
Sue Martenson
781-937-1989
781-937-1026
sue.martenson@analog.com

Dielectric Polymers is Authorized Small Quantity Distributor of INTEGRAL* Adhesive Films from Dow

Holyoke, MA - July 2005 - Dielectric Polymers, Inc., a manufacturer of pressure sensitive tapes and films, has complemented its line of adhesive products with the addition of six heat activated dry films. The Dow Chemical Company, based in Midland, MI, has selected Dielectric Polymers as its distributor of INTEGRAL Adhesive Films for small quantity sales in North America based on the Company’s converting capabilities and responsiveness in the marketplace.

INTEGRAL Adhesive Films are dry, non-tacky adhesive films that are activated by a combination of heat and pressure. These films can be activated through lamination including hot roll, belt, flame, calender and sheet processes. Continuous and piece molding operations are also used to apply the adhesive to various substrates.

INTEGRAL Adhesive Films offer end users performance properties such as U.V. and chemical resistance, dimensional stability, barrier properties, scratch and puncture resistance as well as strength and toughness. These heat activated dry films offer easy storage and handling in addition to design flexibility.

Dielectric Polymers carries INTEGRAL Adhesive Films in various colors and thicknesses with a variety of activation temperatures to meet specific application needs:

· INTEGRAL 801 provides adhesion at low temperatures for bonding temperature sensitive substrates such as synthetic fabrics. It is also used in refrigerator liners and as a protective film for scratch resistance. This adhesive film has FDA compliance for specific direct food applications.

· INTEGRAL 709, 821 and 933 are intermediate temperature activation films used for specialty automotive applications, as an overlay for upgrading photographs and for automotive interior trim applications, respectively.

· INTEGRAL 835 and E100 are high temperature activation films designed for bonding dissimilar substrates. INTEGRAL 835 is used in medical tape applications while E100 is used in automotive headliner lamination and bonding sound dampening materials in door panels.

Dielectric Polymers produces transfer adhesives, double coated tapes and self-wound film tapes for automotive, aerospace, electronics, graphic arts, wireless communications, biotechnology and other industrial markets.

For more information regarding the INTEGRAL Adhesive Film line offered by Dielectric Polymers, please contact Debbie Ernst at 800-628-9007, 413-532-3288 or send inquiries to info@dipoly.com. Or you can visit the Company’s web site at www.dipoly.com.

For product recommendations regarding substrate adhesion or INTEGRAL technical data sheets, please click on www.dowplastics.com

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