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PCB and Electronics News Mentor Graphics and LSI Logic Announce Seamless Product Support for ZSP Processor Cores "Seamless has become an important part of the verification flow for the SoCs we design," said Ai Wei, vice president of HiSilicon Technologies Co., Ltd. (formerly Huawei Technologies ASIC Design Center). "LSI Logic and Mentor's collaboration in delivering Seamless models for the ZSP cores enables us to efficiently verify the hardware and software in systems that embed them." "Seamless provides complete hardware/software co-verification coverage for SoC designers utilizing the ZSP cores. Seamless productivity enhancements enable customers to verify their system in a fraction of the time required by traditional RTL co-simulation approaches," said Tuan Dao, vice president and general manager of ZSP Product Division, LSI Logic Corp. "By easing the co-verification burden, Mentor Graphics allows our customers to achieve design closure quickly and correctly, enabling the successful deployment of ZSP-based products to the market." The cost, power and performance optimization of the ZSP400 and ZSP500 cores make them the licensed DSP of choice for software-intensive applications such as those in wireless, voice and multimedia. The Seamless product provides designers of these emerging applications with unparalleled ability to debug hardware/software interactions while exercising production-level software running on the Seamless model of the ZSP core. The Seamless product's performance profiling capabilities provide accurate measurement of key design parameters, such as bus, memory and software performance, enabling users to evaluate system performance before committing to hardware. "By enhancing its DSP architecture with robust tools and solutions, such as the Seamless PSPs, the LSI Logic ZSP Division is demonstrating its commitment to the market and its strength as a leader in licensing DSP cores and software," said Serge Leef, general manager of the Mentor Graphics SoC Verification Division. "Mentor Graphics is pleased to support the ZSP family of cores as we see growing demand for co-verification solutions supporting these embedded devices." LSI Logic and Mentor Graphics will bring their SoC expertise together with ARM for two seminars in California titled "Enabling Innovation: SoC Design and Verification Solutions from the Industry Leaders." More information on these seminars is available at http://www.mentor.com/products/fv/events/enabling_innovation.cfm. Availability Seamless PSPs for the ZSP400 and ZSP500 DSP cores are available from Mentor Graphics. To find additional product information and technical papers, register for free Seamless workshops and functional verification seminars, please visit www.mentor.com/products/fv/hwsw_coverification/. For information on the ZSP signal processing solutions, visit www.zsp.com. About the LSI Logic ZSP Products Division The LSI Logic ZSP Products Division is a leading licensor of Signal Processing Cores and Solutions. The ZSP Processor Architecture is gaining considerable momentum as the DSP of choice in many key vertical markets including 3G wireless handsets, multimedia and networked voice appliances. The ZSP roadmap offers a range of software compatible cores delivering performance points that meet the cost, power and efficiency constraints of today's SoC designs. A number of standard products are also available for lower volume designs and prototype implementations. ZSP Solution Partners augment the technology with world-class software tools, EDA modeling support and a large portfolio of application software. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. About Mentor Graphics Mentor Graphics Corporation is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronics and semiconductor companies. Established in 1981, the company reported revenues over the last 12 months of over $700 million and employs approximately 3,850 people worldwide. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777; Silicon Valley headquarters are located at 1001 Ridder Park Drive, San Jose, California 95131-2314. World Wide Web site: www.mentor.com. Dielectric Polymers Announces Functional Splicing Tapes
Holyoke, MA - July 2005 For efficiency in splicing roll label stock and other substrates to be coated with pressure sensitive adhesive, Dielectric Polymers, Inc. introduces two new tapes, NT-9511-2SW and NT-9512-2SW. Both tapes are constructed with blue silicone adhesive on a polyester film backing that has a specialized release coating on the backside of the tape to allow adhesive to release at the splice area. These tapes provide splices that do not need to be removed from the web, eliminating label loss which is a critical factor in sequential label and automatically applied label applications. With no liner to remove, these tapes save time and offer ease of use for one-step splicing. NT-9511-2SW and 9512-2SW are cost effective, reducing material waste and improving yields by reducing lost labels. The specialized release coating maintains registration through the splice and provides easy removal of the matrix. Strong splices are assured since these tapes are constructed with an aggressive adhesive that grabs quickly and a high tensile film backing. These tapes are also ideal for wrapping idlers and other in-process rolls that come into contact with adhesive, enhancing operating efficiency. For more information regarding NT-9511-2SW and 9512-2SW Functional Splicing Tapes, please contact Debbie Ernst at 800-628-9007, 413-532-3288 or send inquiries to info@dipoly.com. Or you can visit the Companys web site at www.dipoly.com. |
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