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PCB and Electronics News Nano Superlattice Technology Announces Completion of Nano-coating Mass Production Machinery TAIPEI, Taiwan, May 4 /PRNewswire-FirstCall/ -- Nano Superlattice Technology Inc. (hereinafter as "Nano") (OTC Bulletin Board: NSLT - News), a company engaged in the coating of tools and components with nano structured PVD coatings for the semiconductor, precision machinery and telecommunication industries, announced today the completion of the installation of Nano's newest set of production machinery. The completion of the design and construction of this nano-coating machine is unique and represents the culmination of years of proprietary technology and scientific breakthrough by Nano's research and development team led by Professor Dr. Wolf-Dieter Munz. This machinery will utilize Nano's sophisticated and exclusive superlattice technology to manufacture highly advanced and superhard nano-scale coatings. Currently, Nano believes its "Nano ABS" machine could be the largest machine for deposition of nano scale coatings in the world. The machine will employ ion implantation in combination with magnetron sputtering for the depositing of nitrides of various elements such as titanium, aluminum and vanadium in a high vacuum environment. Utilizing a special atomistic deposition process, the surface of various products will be bombarded and penetrated with high-speed ions which will effectively achieve a structural change in the targeted product allowing it extremely high adhesion properties such as high hardness, high heat-resistance, high abrasion resistance and extending its normal product lifespan by as much as five or ten times. "The nano-coating technology I have developed for Nano Superlattice Technology is among the most advanced in the world," remarked Dr. Wolf-Dieter Munz. "I believe that applied to hi-tech components in the precision electrical engineering industries in Taiwan, China and elsewhere is a significant and previously untapped business opportunity." This technology can be used to create multiple nano-scale layers of thin elemental coatings with special crystalline structures on a product. Each thin nano-coating layer is optimized to a size of merely three to four nanometers in thickness with such coatings reaching half the hardness of diamond. Preliminarily, this nanotechnology will be applied to precision cutting tools such as industrial hobs. The completion of the design and construction of this new production machinery is a milestone for Nano and a significant step in realizing Nano's business goals. About Nano Superlattice Technology Inc. Nano utilizes Arc Bond Sputtering and Superlattice technology to apply multi-layers of super-hard elemental coatings on an array of precision products to achieve a variety of physical properties. The application of the coating on industrial products is designed to change their physical properties, improving an individual product's durability, resistance, chemical and physical characteristics as well as performance. Nano's super-hard alloy coating materials were especially developed for printed circuit board drills in response to special market requirements. Nano plans to continue research and development into these techniques due to the vast application range for this type of nanotechnology. Safe Harbor under the Private Securities Litigation Reform Act of 1995: The statements which are not historical facts contained in this press release are forward-looking statements that involve certain risks and uncertainties including but not limited to risks associated with the uncertainty of future financial results, regulatory approval processes, the impact of competitive products or pricing, technological changes, the effect of economic conditions and other uncertainties as may be detailed in Nano's filings with the Securities and Exchange Commission. Nothing in this press release shall be construed as an offer to buy or sell any securities herein. This release was issued on behalf of the above organization by Send2Press(TM), a unit of Neotrope®. http://www.Send2Press.com
Components Corp. Now Offers A RoHS-Compliant, Low-Profile SMT Test Points Series Components Corp., a world leader in the design and manufacture of circuit board hardware technology, releases the 100% RoHS-compliant TP-107 Series of low-profile, surface-mount printed circuit board test points. Denville, NJ (PRWEB) June 11, 2005 -- Announced today by Components Corp., a world leader in the design and manufacture of circuit board hardware technology, is the 100% RoHS-compliant TP-107 Series of low-profile, surface-mount printed circuit board test points. The TP-107 Series is engineered specifically for employment by fabricators of high-density SMT printed wiring boards who demand reliable, safe and durable testing both during and after manufacture, as well as the capability to easily, quickly, and accurately identify faults. The unparalleled superiority of the device"s bond to the PCB is the result of Component Corp"s unique forming process. This proprietary process, which consists of forming the flat wire design in a spiral wrap at the mounting base, effectively doubles the surface area of the mounting base to enable a more rugged connection when adhered to the solder pad. Therefore, an excess of 18 pounds of force would be required to dislodge the test point. Additionally notable is the TP-107s" singular loop design which provides a positive and secure location for miniature spring-loaded clips, probes, and hooks. Pricing for Component Corp"s TP-107 Series of RoHS-compliant test points is $0.078 ea. in quantities of 1,000. Delivery is from stock to 4 weeks. Samples are available upon request About Components Corporation Components Corporation Contact: Christopher Minter ### Components Corp. CMD's ASIP filter arrays offer superior EMI filtering performance With the adoption of higher resolution color displays and camera imagers spreading to a larger segment of the handset market, there is a growing need for EMI filters that offer higher cutoff frequencies while providing a greater level of attenuation performance at the frequency band of 800MHz through 3GHz, said CMD. The CM1430 and CM1431 devices are the first packaged EMI filters that meet these exacting requirements in a form factor fully optimized for use in space constrained, mobile handset applications, the company added. Both the CM1430 and CM1431 utilize C-R-C pi filters with values of 8.5pF-100ohms-8.5pF and 15pF-100ohms-15pF respectively corresponding to cutoff frequencies of 200MHz and 120MHz. The high cutoff frequencies make these new products suitable for filtering high resolution display and camera modules interfaces, which utilize data rates up to 80Mbps. The CM1430 and CM1431 achieve attenuation of -25dB and -35dB, respectively at 1GHz, and the attenuation of both parts is -35dB at 3GHz. Both products feature flow through routing for each filter channel which contributes to enhanced filter performance and ease of PCB layout. Additionally, CMD said, superior filter performance across all channels is achieved through the large area ground pad on the bottom of the TDFN package that minimizes parasitic inductance. In addition to filtering, both products also provide ESD protection up to -15kV contact discharge per IEC61000-4-2 Level 4 specification. The two filter arrays are both available in 4, 6 and 8 channel configurations. The package dimensions of the 4, 6 and 8 channel versions are 1.7-by-1.35mm (8 leads), 2.5-by-1.35mm (12 leads), and 3.3-by-1.35mm (16 leads), respectively. Each of these packages is available in Pb-free finish. Samples of the CM1430 and CM1431 are already available. Sample pricing ranges between 42 cents and 59 cents each in 1,000-unit quantities, depending on the channel configuration. Production for both families is scheduled for Q3 2005. |
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