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New Nitrogen UltraFill Nozzles from Speedline Technologies Delivers Solution to Overcome Challenges of Lead-Free Soldering

Speedline Technologies has introduced its new UltraFill™ Lead-Free Nozzles – featuring an innovative technology and design to enable electronic manufacturers to overcome a variety of process challenges inherent in lead-free wave soldering.

Franklin, MA (PRWEB) February 23, 2005 -- Speedline Technologies has introduced its new UltraFill™ Lead-Free Nozzles – featuring an innovative technology and design to enable electronic manufacturers to overcome a variety of process challenges inherent in lead-free wave soldering.

“Soldering with lead-free alloys requires manufacturers to answer a host of new and formidable process challenges – ranging from slower wetting times to more viscous flow characteristics to higher temperatures,” said Keith Howell, Wave Solder Product Manager. “Speedline’s new UltraFill nozzles provide the solution – and deliver both improved process performance and product quality.”

Speedline’s new UltraFill nozzles feature an innovative new design and technology. The nozzles are 40% wider than traditional tin/lead nozzles to increase contact length and dwell time. The nozzles are also placed closer together to reduce the temperature drop between the nozzles – so that less heat is needed to reflow solder joints in the second wave. As a result, UltraFill nozzles deliver better hole fill without requiring a slowing of the conveyor, while reducing bridge defects and dross production.

A Nitrogen shroud is available as an option – and allows for either air or nitrogen operation, as determined by the desired recipe, without the need to change nozzles. The shroud both encompasses the nozzles in the pot and contains the dross in the solder pot. The shroud lifts for easy maintenance and dedrossing – without nozzle removal.

Recent applications have shown UltraFill nozzles enhance both product quality and process performance – ranging from the elimination of the need for touch-up of poor hole fills to dramatic reductions in bridges/solder shorts.

The new UltraFill Lead-Free Nozzles are available an option on the Vectra™ and Electra® wave soldering systems or as an upgrade to existing, installed equipment. The nozzles are compatible with the Omega™ wave and the Debridging Airknife.

Speedline Technologies officially introduced its new new UltraFill Lead-Free Nozzles at the APEX 2005 Expo, held February 22-24, 2005, in Anaheim, Calif. The system is available immediately from Speedline distributors and representatives. For additional information, contact Speedline Technologies at 1-508-520-0083 or visit http://www.speedlinetech.com.

About Speedline Technologies
Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands — Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline was named as the “2005 Surface Mount Technology Company of the Year” by Frost & Sullivan.

For more information, visit us at http://www.speedlinetech.com, or contact us at:
· USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: e-mail protected from spam bots;
· Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: e-mail protected from spam bots;
· Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: e-mail protected from spam bots.

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This press release was posted by the following PR Firm
Tiziani Whitmyre, Inc. (View Listing in Directory of PR Firms)

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