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iNEMI Premieres Latest Roadmap at IPC Printed Circuit Expo/APEX/Designers Summit; Gap analysis meetings scheduled to identify and prioritize industry needs

HERNDON, Va. --(Business Wire)-- Feb. 11, 2005 -- The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium focused on strengthening the global electronics manufacturing supply chain, will premiere findings of its 2004 roadmap at the IPC Printed Circuits Expo/APEX/Designers Summit, February 22-24, in Anaheim, Calif. iNEMI is also planning several "gap analysis" meetings at the conference to discuss roadmap findings and prioritize industry needs in the areas of system-in-package (SiP), board assembly and substrates, environmentally conscious electronics, and product lifecycle information management.

Jim McElroy, executive director and CEO of iNEMI, will discuss findings and implications of the roadmap in a keynote address Thursday, February 24, at 8:00 a.m. This latest edition of the iNEMI roadmap is the most extensive to date, with 26 chapters that cover seven product sectors and 19 technology, infrastructure and business practice areas. New this year are chapters on SiP, medical products, netcomm products (networking, datacom and telecom) and sensors. As with previous roadmaps, it addresses the shifts in each of the technology, infrastructure and business practice areas discussed, along with the related technology gaps and business needs.

Development of the tenth anniversary edition of the roadmap involved 470 individuals from 220 organizations located in 11 countries. In keeping with the consortium's decision to expand its focus globally, the 2004 roadmap marks the first time iNEMI actively recruited participation from Asian and European organizations to help ensure a global view of the electronics industry.

"Globalization demands that we think beyond continental boundaries as we consider future technology deployment and research needs," says McElroy. "It's important that we focus globally as we identify the gaps that could potentially impede progress of the electronics manufacturing industry worldwide."

Gap Analysis Meetings

The iNEMI roadmap compares technology trends with anticipated product needs, and identifies "gaps" and "showstoppers" that are potential threats to industry advancements. Gap analysis meetings, such as the ones scheduled at APEX, stimulate in-depth discussions among individuals from various segments of the industry to develop action plans that will address industry needs and help close the gaps identified by the roadmapping process. Four of the iNEMI Technology Integration Groups (TIGs) will hold gap meetings at APEX: Board Assembly and Substrates (jointly), Environmentally Conscious Electronics, Product Lifecycle Information Management (PLIM) and the newly formed System-in-Package (SiP) TIG.

"These gap analysis meetings are a very important part of our process," said McElroy. "Our biannual roadmaps identify industry needs, then we follow up with these in-depth gap discussions to identify areas where we can collaboratively address common needs and goals through R&D, innovation, deployment and standards development. It is important that we involve broad industry participation in the process and why we have chosen APEX as a location for several of these meetings."

Other iNEMI Meetings

In addition to the roadmap keynote and gap analysis meetings, iNEMI has several other meetings scheduled at APEX. One of the APEX forums features a report from the iNEMI Lead-Free Assembly & Rework Project (see schedule below). The project team will detail the results of their three-year project, which was undertaken to develop Pb-free assembly and rework processes for large (9" X 17"), thick (0.135"), double-sided, 14-layer, printed wiring boards (PWBs). This workshop will discuss the Pb-free SMT rework and wave solder development process using the iNEMI-recommended Sn3.9Ag0.6Cu solder, and the results of the reliability stress testing for these complex assemblies. Lessons learned and recommendations for future work will be discussed.

Meeting Meeting Description Date/Time Location
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Board Assembly & Gap analysis meeting Tues, 2/22; M-Desert Substrates TIGs 8:00 am-noon Springs

Panel includes present- Future in ations about iNEMI cost/ Optoelectronic performance analysis for Tues, 2/22; Technology (APEX optical and copper high- 10:00 a.m- CC technical speed backplanes and noon conference) cleanliness specification for single-mode connectors.

System in Package Gap analysis meeting Wed, 2/23; M-Desert (SIP) TIG 8:00 am-noon Springs

Optoelectronics Project meeting Wed, 2/23; M-Desert for Substrates 1:00-3:00 pm Springs

iNEMI Lead-Free Assembly & Review results of the iNEMI Wed, 2/23; Rework Forum Pb-free Rework & Assembly 3:00-5:00 pm CC (APEX free Project forum #F06)

Product Lifecycle Information Wed, 2/23; M-Desert Management 2006 iNEMI roadmap planning 3:00-5:00 pm Springs Technology Working Group

APEX KEYNOTE APEX free keynote covers Thurs, 2/24; 2004 iNEMI highlights of the 2004 8:00-9:00 am CC Roadmap iNEMI Roadmap

Environmentally Conscious Gap analysis meeting Thurs, 2/24; M-San Electronics 8:00 am-noon Diego (ECE) TIG

Product Lifecycle Information Gap analysis meeting Thurs, 2/24; M-Los Management 8:00 am-noon Angeles (PLIM) TIG

IC Packaging Vision Roadmaps Overviews of three Thurs, 2/24; (APEX technical roadmaps: JISSO, iNEMI 10:30 am-noon CC conference) SIP and ITRS

Materials Thurs, 2/24; M-San Composition Project meeting 1:00-3:00 pm Diego Data Exchange

All iNEMI meetings listed here are open to non-members, and the APEX forums are open to conference attendees. M = Anaheim Marriott (adjacent to the convention center) CC = convention center *T

How to Order the iNEMI Roadmap

The 2004 iNEMI Roadmap will be available to industry on CD-ROM, beginning March 1. CDs can be purchased online at http://www.nemi.org/cms/roadmapping/2004roadmaporder.html ($250 for non-members). Anyone who is uncertain about whether the roadmap will be of interest or is relevant to their particular business, the 53-page Executive Summary provides a brief summary of the information covered in each of the 26 chapters. It is available for $50 and if the purchaser decides to buy the complete roadmap, purchase price of the summary will be applied against the price of the roadmap.

About iNEMI

The International Electronics Manufacturing Initiative's mission is to assure leadership of the global electronics manufacturing supply chain. Based in Herndon, Va., the industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. For additional information about iNEMI, visit www.iNEMI.org.

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