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Regal Electronics Announces Its Entire Line of PCB Mount Mini-din Connectors Will Now Have Available Shielding and Gaskets for EMI/RFI Protection.

Regal Electronics announces its entire line of PCB mount mini-din connectors will now be available with a full metal shield and EMI/RFI gaskets on the mounting face for superior conducted and radiated noise suppression. No other manufacturer offers PCB mount mini-din connectors with both metal shielding and an EMI/RFI suppression gasket.

Sunnyvale, CA (PRWEB) February 10, 2005 -- Regal Electronics announces its entire line of 5145P3 Series PCB mount mini-din connectors will now be available with a full metal shield and EMI/RFI gaskets on the mounting face for superior conducted and radiated noise suppression. Available in 3 through 8 pin configurations, the gasket option for the mini-din connectors is the same one used on Regal’s patented RJ-45 connector line. The new connectors also have high temperature material in the housing and can be ordered in a RoHS compliant configuration.

The conductive gasket on the 5145P3 Series provides excellent conducted and radiated (EMI/RFI) noise attenuation over shielded versions and is fully interchangeable with both shielded and unshielded versions (same footprint & panel cutout). The connectors are easy to mount and offer an edge in world markets in meeting EMI/RFI compliance specifications. No other manufacturer offers PCB mount mini-din connectors with both metal shielding and an EMI/RFI suppression gasket.

The new mini-din connectors provide easily identified pin configurations for applications that require multiple mini-din connectors on a single PC board or device. The connectors are priced at $ 0.98/ea. in quantities of 1,000.

About Regal Electronics, Inc.
Since 1976, Regal has manufactured quality electronic components, speakers, connectors, transformers, power supplies, and a wide variety of related products and services from its operations in the United States, China and Taiwan. Engineering support for Regal Electronics, Inc. line of products is located at its Sunnyvale, California, headquarters.

Flometrics releases enhanced PCB design software

SAN FRANCISCO — 19 April 2005 - Flomerics has released a new version of its PCB design software that includes more than 25 improvements and enhancements designed to improve usability and tighten integration between electrical and mechanical design of printed circuit boards, the company said.

FLO/PCB v2.2 enhancements include automatic "Manhattan distance" calculation and constraint management, designed to enable the introduction of first order signal integrity requirements early in the design process.

Other key enhancements to the latest version of FLO/PCB include full integration with Flomerics' Flopack model generation product, styled display of interconnects depicting signal speed and quantity, support of Intermediate DataFormat-defined placement keep-out regions and annotation auto-sizing to improve readability of functional block and component placement diagrams.

According to Flomerics, (Marlborough, Mass.) FLO/PCB 2.2 promotes a conceptual design process that integrates electrical and mechanical design for printed circuit boards, enabling early resolution of component placement and thermal issues. The company said the product has received positive feedback from existing customers, including Agilent, BAE Systems, Cisco Systems, Rockwell International, Tellabs and Thales.

Other enhancements to the tool include specialized menus for rapid creation of functional block diagrams, automatic creation of physical layout and thermal model from the functional block diagram, 3D airflow and temperature prediction for both sides of the board and a fully-integrated library capability supporting JEDEC standards for component thermal models.

Fidus & Spirent Make Waves

OTTAWA, May 30 /CNW Telbec/ - Ottawa's Fidus Systems has completed design of a new-generation product for UK-based Spirent Communications. It allows makers of DSL telecom equipment to test their emerging products to high-performance standards.

Telecom makers are now better-equipped to deliver clear, high-speed Internet signals under adverse conditions. "The new arbitrary wave-form generator we designed for Spirent is entering production," says Don Moncion, Fidus' Vice President of Business Management. "It allows telecom developers and independent test labs to put new products through much more rigorous laboratory testing than ever before."

"This product follows another successful joint project with the designers at Fidus," says John Bobyn, Spirent's Director of Engineering. "The first one sold internationally into significant test laboratories in Japan and other markets." "We keep returning to Fidus because of the breadth of their development skills. They've delivered an excellent design on time and on budget," says Bobyn.

Fidus Systems:

Fidus supplies expert electronic designs for industrial controls, video, telecommunications, aerospace, and biomedical instruments. We develop complete products for our customers. We also supply targeted design of architecture, hardware, FPGA, software, printed circuit board layout and high-speed signal integrity analysis. Our customers include start-ups and multinationals in San Jose, San Francisco, Boston, New York, Ottawa, Montreal, Toronto, Waterloo, and Winnipeg. www.fidus.ca

Spirent Communications

At Spirent we work behind the scenes to help the world communicate faster, better and more often. For decades, the world's leading communications companies have used Spirent solutions to conduct performance analysis tests in labs on the latest technologies. From wireline to wireless to satellite, Spirent offers a complete portfolio of solutions. www.spirentcom.com

For further information: Don Moncion, Fidus VP Business Management, (613) 828-0063 x 336, Don.Moncion@fidus.ca; Denise Allen, Fidus Director of
Communications, (613) 828-0063 x 312, Cell: (613) 355-7035, Denise.Allen@fidus.ca

Visit us at NPE 2003, The World's Plastics Showcase

Dielectric Polymers and Stik-II Products, Divisions of Adhesive Applications, Inc., will unveil new high performance tapes for the plastics industry at NPE 2003, to be held at McCormick Place in Chicago from June 23 – 27. More than 2,000 exhibitors are slated to feature product innovations in the automotive, appliance, medical and packaging markets, among others. With more than 90,000 industry professionals from over 100 countries expected to attend, NPE 2003 promises to be the world’s largest plastics exposition of the year.

Dielectric Polymers will introduce a new silicone/acrylic double coated tape, NT-1020, designed for bonding silicone coated substrates to non-silicone coated substrates. This tape offers plasticizer migration resistance on the acrylic side and bonds well to low surface energy materials on the silicone side, making it ideal for use with various plastics. High adhesion, solvent and temperature resistance are additional benefits for membrane switch assembly and other specialized bonding applications.

Stik-II Products will present a line of aqueous-based adhesives offered in acrylic and an acrylic/rubber hybrid coated on open and closed cell foam. These products are used in automotive applications for noise, dust and vibration control. Roll products are supplied in longer length rolls and spools for in-line application to plastic extrusions. In addition, several double coated Mylar® tapes coated in various adhesive gauges and designed to provide aggressive adhesion will be featured.

To find out more about our plastics-related tapes and films, visit us in booth 3120 this June.

For more information, please contact Shannon Laplante, Dielectric Polymers, Inc., 218 Race Street, Holyoke, MA 01040, Tel.: 800-628-9007 / 413-532-3288 or visit the company's web site at http://www.dipoly.com

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