Sunday, October 05, 2008

 

Revolution for Semiconductor Packaging and Circuit Assembly

The Next Revolution for Semiconductor Packaging and Circuit Assembly Industries

The latest market forecasts show that 3D-TSV wafers will be shipped in millions and have the potential to impact as much as 25% of the memory business by 2015. If we exclude memories, our analysis show that 3D-TSV wafers will account for more than 6% of the total semiconductor industry by 2015.

Montreal, Canada, August 20, 2008 -- Electronics.ca Publications, the electronics industry market research and knowledge network, announces the availability of a new market study entitled "3D TSV Interconnects: Equipments and Materials 2008 Report".

The Semiconductor manufacturing industry is today facing more than ever the challenge to explore the so-called More-than-Moore 3-D integration route in order to pursue the aggressive scaling of the historical Moore's Law. The whole Semiconductor industry supply chain is being concerned: from IDMs to Fabless and CMOS foundries, from OSATs to Substrate and Circuit Assembly players as well.

3D integration with TSVs could accelerate even more current consolidation happening in CMOS wafer fabs and the shift toward a fabless foundry model. As the whole industry supply chain is being concerned, all players are at the moment positioning on the technology and evaluating which 3-D technology platforms need to be invested and developed for their own business.

Times are bright for packagers from all across the world, according to the report. A whole new infrastructure needs to be developed in the "Mid-end" of the semiconductor industry supply chain. New technologies, equipments and advanced materials coming both from the Front-end and the Back-end worlds are being developed and will give rise to a revival of the semiconductor packaging and circuit assembly industries.

The latest market forecasts show that 3D-TSV wafers will be shipped in millions and have the potential to impact as much as 25% of the memory business by 2015. If we exclude memories, our analysis show that 3D-TSV wafers will account for more than 6% of the total semiconductor industry by 2015.

The report also reveals that different 3-D technology platforms, such as 3-D WLP Encapsulation platform, 3-D TSV Stack platform, and 3-D Interposer Module platform, need to be developed as they will serve different application needs and will correspond to different players in the supply chain.

This new study aims at giving a better understanding about the right timeline for the successful adoption of the Through Silicon Via (3-D TSV interconnect) technology across the wide range of its driving end-applications. The potential impact of 3-D technologies on the semiconductor manufacturing market (at the device / equipment / material levels) is quantified. It also evaluates how the industry supply chain is likely to evolve in the 2006-2015 time frames.

Details of the new report can be found on Electronics.ca Publications' web site:
http://www.electronics.ca/reports/semiconductor_manufacturing/3d_tsv_interconnects.html

Contact Information
Electronics.ca Publications
Chiaki Sadanaga
+1 514 429 1520
pr@electronics.ca
http://www.electronics.ca


Business Productivity
Laptop Memory
Dual Core Computers
Time Domain Reflectometry



Saturday, October 04, 2008

 

New Crystalline Automotive Window Film

3M Crystalline Automotive Window Film

Energy Products Distribution is now selling 3M's latest Automotive Window Film - Crystalline.

Baltimore, MD, October 02, 2008 -- 3M Crystalline Automotive Window Films are the latest in automotive window film technology from 3M Company. They are made using nano-technology, are virtually clear, and offer up to 97% infrared heat reduction (900-1000 nm). They have been designed for the consumer who wants the benefits of window tinting but not the dark appearance commonly associated with it. Because they are so light, Crystalline films are legal in most states. They will not fade, purple, bubble, blister, peel, or interfere with satellite signals; and the 3M Company guarantees it for as long as you own your car. These films are offered in a variety of light transmissions (40%, 50%, 60%, and 70%) and sizes (20", 24", 36" and 60").

See how Crystalline and other 3M automotive window films look on the windows of your car by visiting
http://www.epdwindowfilm.com/Page.aspx?content=sec.FilmViewer.

Automotive window film dealers looking to offer Crystalline or other 3M automotive window films to their clients should visit
http://www.epdwindowfilm.com/Page.aspx?content=sec.BusinessOps.

Energy Products Distribution (EPD) is a 3M-authorized distributor of 3M Window Film products. Learn more at www.epdwindowfilm.com or contact Manny Hondroulis at 1-800-537-3911.

Contact Information
Energy Products Distribution
Manny Hondroulis
800-537-3911
mhondroulis@epdwindowfilm.com
www.epdwindowfilm.com


Save On Car Insurance Costs
Are You A Player's Player?
Find Companies In India
Laquinta Storage Options