Sunday, June 17, 2007
Strategic Partnership To Address The Need For Chip And Package Co-Design
Optimal Corporation, Rio Design Automation Partner to Solve Chip-Package Co-Design Challenge; Integration of Toolsets First Joint Development Effort
SAN JOSE -- Optimal Corporation, provider of 3D power and signal integrity analysis for IC Package, System-in-Package (SiP) and PCB design, and Rio Design Automation Inc. announced today the signing of a far-reaching strategic partnership to address the need for chip and package co-design.
As part of this announcement, they introduced immediate availability of the first jointly developed solution, a link between Rio Design Automation's RioMagic package-aware chip design software and Optimal's PakSi-E signal and power integrity software.
This integration addresses the need for engineers to consider package requirements during chip design because of increased semiconductor complexity and the emergence of new technologies, such as SiP emerge.
"Companies fast tracking the chip development cycle cannot wait until the package designer analyzes 3D signal and power integrity, especially as we move into the multi-gigahertz range," says Dave DeMaria, chief executive officer (CEO) of Optimal. "Our customers see increased need for a concurrent chip/package design flow, which Rio Design Automation and Optimal have accomplished with this tight tool integration."
In the combined flow, RioMagic's fast analysis engines conduct interconnect synthesis while PakSi-E is used for accurate 3D sign-off verification. RioMagic, package-aware chip design and optimization software to bridge the gap between the design of high-performance ICs, their packages and the rest of the system design, performs I/O-to-package ball interconnect synthesis and enables chip-package co-optimization. PakSi-E allows fast and accurate extraction, signal, power and simultaneous switching noise (SSN) analysis of the entire package.
Remarks Kaushik Sheth, Rio Design Automation's CEO: "This powerful combination of Optimal's 3D signal and power integrity analysis with our package-aware chip design offers an accurate and effective solution."Future development efforts will be announced over the next several months.
For more details, contact Joel McGrath at (408) 844-8038, Ext. 15, or via email at jmcgrath@rio-da.com.
About Optimal Corporation
Optimal Corporation, founded in 1995, is the leader in 3D power and signal integrity analysis for IC Package, System-in-Package (SiP) and PCB design. Our innovative solutions enable design teams to concurrently analyze and optimize the IC together with the Package and the Packaged IC on the PCB. By providing the highest performance, best ease-of-use and pinpoint accuracy, our solutions allow engineers to create designs optimized for power and signal integrity in the shortest possible time. Through seamless integration with all of the major CAD design flows, Optimal solutions help customers achieve the shortest and most efficient overall design cycle time. Optimal's technology is embedded in the Cadence Allegro flow and endorsed in the TSMC Reference Flow. Optimal is a TSMC Technology Alliance Partner and a member of the Cadence Connections Emerging Solutions Program. Optimal Corporation is located at: 6980 Santa Teresa Blvd., Suite 100, San Jose, CA 95119-1346. Tel: 408-363-6300. Fax: 408-363-6305. For more information visit www.optimalcorp.com.
About Rio Design Automation
Rio Design Automation is an electronic design automation (EDA) company bridging the gap between the design of high-performance integrated circuits (ICs) and packages, and a chip's integration with the rest of the electronic system. Its revolutionary approach offers chip designers package-aware software to that enables I/O optimization tradeoffs to take place in the context of the package and the printed circuit board (PCB). Corporate headquarters is located at: 2901 Tasman Drive, Suite 112, Santa Clara, Calif. 95054. Telephone: (408) 844-8038. Facsimile: (408) 844-8945. Email: info@rio-da.com. Website: http://www.rio-da.com.
Optimal Corporation and the Optimal logo are trademarks of Optimal Corporation. Package-Aware Chip Design is a trademark of Rio Design Automation. Optimal Corporation and Rio Design Automation acknowledge trademarks or registered trademarks of other organizations for their respective products and services.
